Mode 1 LTE MD01P
from SoftBank
Bro
0
127
300
145
7630
2048
Overview & Features
Technical Specifications
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Overview & Features
Brand
SoftBank
Model
Mode 1 LTE MD01P
Released
2015 Dec
Announced
2015 Dec
General Extras
Haptic touch feedback
Hardware Designer
P-UP
Technical Specifications
Display
Pixel Size
0.08648 mm/pixel
Resolution
720x1280
921600 pixels
Display Area
6891.9 square millimeter
Display Type
Color IPS TFT LCD
display
Display Width
62.26 mm
Pixel Density
294 PPI
Display Height
110.69 mm
Display Diagonal
127 mm
Display Color Depth
24 bit/pixel
Display Illumination
Yes
Display Subpixel Scheme
RGB Matrix (3 subpixels)
Display Area Utilization
66.3%
Number of Display Scales
16.8M
Scratch Resistant Screen
No
Display Dynamic Range Depth
8 bit/pixel
Horizontal Full Bezel Width
8.94 mm
Display Light Reflection Mode
Yes
Power Supply
Battery
Lithium-ion polymer (LiPo)
built-in
1-cell
Talk Time
8.3 hours
Standby Time
300 hours
Average Current Talking
277 mA
Average Standby Current
8 mA
Nominal Battery Capacity
2300 mAh battery
Nominal Cell Capacity (1st cell)
2300 mAh cell
Sound Playing
Audio Output
3.5mm
Loudspeaker(s)
mono
Cellular Phone
SIM Card Slot
Micro-SIM (3FF)
Call Alert Sound
64-chord melody
Cellular Antenna
Internal antenna
Cellular Controller
Qualcomm MSM8916
Supported Cellular Bands
UMTS 2100MHz (Band I, IMT)
CDMA 800MHz (BC0, 850)
CDMA 2100 MHz (BC6)
LTE 2100 MHz (Band 1)
LTE 1800 MHz (Band 3)
LTE 850 MHz (Band 26)
bands
Complementary Phone Services
Voice transmission
Voice speaker
Vibrating Alert
Speakerphone
ANC
Voice over LTE (VoLTE)
Supported Cellular Data Links
UMTS 384 kbps (W-CDMA)
HSUPA (Cat. unspecified)
HSDPA (Cat. unspecified)
HSPA+ 21.1 Mbps (Cat. 18)
cdmaOne (IS-95)
CDMA2000 1xRTT (IS-2000)
CDMA2000 1xEV-DO Rel. 0
LTE (Cat. unspecified)
LTE 150 Mbps / 50 Mbps (Cat. 4)
data links
Audio Subsystem
Audio Channel(s)
stereo
Sound Recording
Microphone(s)
mono
Auxiliary Camera
Aux. Camera Image Sensor
No
Built-in Sensors
Built-in compass
Yes
Additional sensors
Light intensity sensor
Proximity sensor
Built-in accelerometer
Yes
Operative Memory
RAM Type
mobile (LP) DDR3 SDRAM
RAM Capacity
2048 MiB RAM
Ingress Protection
Protection from liquids
Yes
Protection from solid materials
Yes
Control Peripherals
Touchscreen Type
Capacitive multi-touch sensing
screen
Touchscreen Simultaneous Touch Points
5-point
Graphical Subsystem
Graphical Controller
Qualcomm Adreno 306
Dedicated Graphics Memory
0.125 MiB
Non-volatile Memory
Non-volatile Memory Type
Flash EEPROM
Non-volatile Memory Capacity
7630 MiB
Non-volatile Memory Interface
eMMC 4.5
Physical Attributes
Mass
145 g
Depth
7.9 mm
Width
71.2 mm
Height
146 mm
Bounding Volume
82.1 ccm
Multimedia Broadcast
FM Radio Receiver
FM radio (88-108 MHz)
Proprietary headset as antenna
Satellite Navigation
GPS Antenna
Internal antenna
Navigation Controller
Qualcomm MSM8916 gpsOne
Supported GPS protocol(s)
GPS (NMEA 0183)
Complementary GPS Services
Simultaneous GPS (S-GPS)
Assisted GPS
Geotagging
QuickGPS
Supported GLONASS protocol(s)
L1OF
Software Environment
Platform
Google Android
Operating System
Google Android 5.1 (Lollipop)
Audio/Video Interfaces
A/V Out
No
Auxiliary Camera No. 2
Aux. 2 Camera Image Sensor
No
Auxiliary Camera No. 3
Aux. 3 Camera Image Sensor
No
Auxiliary Camera No. 4
Aux. 4 Camera Focus
No
Aux. 4 Camera Image Sensor
No
Primary Camera System
Zoom
1.0 x optical zoom
Flash
single LED
Focus
Contrast Detection Autofocus (CD AF)
Video Recording
1920x1080 pixel
30 fps
Camera Placement
Rear
Camera Resolution
3264x2448 pixel
Camera Image Sensor
CMOS
Camera Extra Functions
HDR photo
Macro mode
Face detection
Recordable Image Formats
JPG
Recordable Video Formats
3GP , 3G2 , MPEG4
Number of effective pixels
8.0 MP camera
Geographical Attributes
Market Regions
Asia
Mobile Operator
SoftBank Corp.
Market Countries
China
HK
Japan
Secondary Camera System
Secondary Camera Sensor
CMOS
Secondary Video Recording
1280x720 pixel
24 fps
Secondary Camera Placement
Front
Secondary Camera Resolution
1600x1200 pixel
Secondary Camera Number of pixels
1.9 MP sec. cam
Secondary Recordable Image Formats
JPG
Secondary Recordable Video Formats
3GP
Communication Interfaces
USB
USB 2.0
USB Hi-Speed (480 Mbps)
Bluetooth
Bluetooth 4.0
Internal antenna
USB Services
USB charging
Wireless LAN
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Internal antenna
USB Connector
USB Series Micro-B (Micro-USB)
Wireless Services
Wi-Fi Tethering
Bluetooth profiles
A2DP
AVRCP
Expansion Interfaces
TransFlash
microSD
microSDHC
Secondary Cellular Phone
Sec. Supported Cellular Networks
No
Secondary Auxiliary Camera
Sec. Aux. Cam. Image Sensor
No
Application processor, Chipset
CPU
Qualcomm Snapdragon 410 MSM8916, 2014, 64 bit, quad-core, 28 nm, Qualcomm Adreno 306 GPU
CPU Clock
1200 MHz
Secondary Auxiliary Camera No. 2
Sec. Aux. 2 Cam. Image Sensor
No
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