Overview & Features
Technical Specifications
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Overview & Features
Brand
Kyocera
Model
Digno U TD-LTE
Released
2015 Feb 27
Manufacturer
Kyocera Communications
Hardware Designer
Kyocera Communications
List of Additional Features
AXGP, MIL-STD-810G
Technical Specifications
Display
Pixel Size
0.1153 mm/pixel
Resolution
540x960
518400 pixels
Display Area
6891.9 square millimeter
Display Type
Color TN-TFT LCD
display
Display Width
62.26 mm
Pixel Density
220 PPI
Display Height
110.69 mm
Display Diagonal
127 mm
Display Color Depth
24 bit/pixel
Display Illumination
Yes
Display Subpixel Scheme
RGB Matrix (3 subpixels)
Display Area Utilization
65.6%
Number of Display Scales
16.8M
Scratch Resistant Screen
No
Horizontal Full Bezel Width
10.74 mm
Display Light Reflection Mode
Yes
Power Supply
Battery
Lithium-ion
built-in
1-cell
Nominal Battery Capacity
2300 mAh battery
Nominal Cell Capacity (1st cell)
2300 mAh cell
Sound Playing
Audio Output
3.5mm
Loudspeaker(s)
mono
Cellular Phone
SIM Card Slot
Yes
Call Alert Sound
64-chord melody
Cellular Antenna
Internal antenna
Cellular Controller
Qualcomm MSM8916
Supported Cellular Bands
GSM 900MHz (B8)
GSM 1800MHz (B3)
GSM 1900MHz (PCS, B2)
UMTS 2100MHz (Band I, IMT)
UMTS 900MHz (Band VIII)
LTE 2100 MHz (Band 1)
LTE 1800 MHz (Band 3)
LTE 900 MHz (Band 8)
TD-LTE 2500 MHz (Band XLI)
bands
Complementary Phone Services
Voice transmission
Voice speaker
Vibrating Alert
Speakerphone
Supported Cellular Data Links
GPRS (Class unspecified)
UMTS 384 kbps (W-CDMA)
HSUPA (Cat. unspecified)
HSDPA (Cat. unspecified)
HSPA+ 21.1 Mbps (Cat. 18)
LTE (Cat. unspecified)
LTE 150 Mbps / 50 Mbps (Cat. 4)
data links
Audio Subsystem
Audio Channel(s)
stereo
Sound Recording
Microphone(s)
mono
Auxiliary Camera
Aux. Camera Image Sensor
No
Built-in Sensors
Additional sensors
Light intensity sensor
Proximity sensor
Built-in accelerometer
Yes
Operative Memory
RAM Type
mobile (LP) DDR3 SDRAM
533 MHz
RAM Capacity
1024 MiB RAM
Ingress Protection
Protection from liquids
7 Protected against the effect of immersion up to 1m of depth
Protection from solid materials
5 Protected against dust with limited ingress (no harmful deposit)
Military Standard Compliance (MIL-STD)
MIL-STD-810G
Control Peripherals
Touchscreen Type
Capacitive multi-touch sensing
screen
Touchscreen Simultaneous Touch Points
Yes
Graphical Subsystem
Graphical Controller
Qualcomm Adreno 306
Dedicated Graphics Memory
0.125 MiB
Non-volatile Memory
Non-volatile Memory Type
Flash EEPROM
Non-volatile Memory Capacity
7629 MiB
Non-volatile Memory Interface
eMMC 4.5
Physical Attributes
Mass
146 g
Depth
10.8 mm
Width
73 mm
Height
144 mm
Bounding Volume
113.5 ccm
Multimedia Broadcast
FM Radio Receiver
No
Digital Media Broadcast
ISDB-T One-Seg
receiver
Pull-out antenna
Satellite Navigation
GPS Antenna
Internal antenna
Navigation Controller
Qualcomm MSM8916 gpsOne
Supported GPS protocol(s)
GPS (NMEA 0183)
Complementary GPS Services
Simultaneous GPS (S-GPS)
Assisted GPS
Geotagging
QuickGPS
Supported GLONASS protocol(s)
L1OF
Software Environment
Platform
Google Android
Operating System
Google Android 4.4.4 (KitKat)
Japanese
Audio/Video Interfaces
A/V Out
No
Auxiliary Camera No. 2
Aux. 2 Camera Image Sensor
No
Auxiliary Camera No. 3
Aux. 3 Camera Image Sensor
No
Auxiliary Camera No. 4
Aux. 4 Camera Focus
No
Aux. 4 Camera Image Sensor
No
Primary Camera System
Zoom
1.0 x optical zoom
Flash
single LED
Focus
Contrast Detection Autofocus (CD AF)
Video Recording
1920x1080 pixel
30 fps
Camera Placement
Rear
Camera Resolution
2592x1944 pixel
Camera Image Sensor
CMOS
Camera Extra Functions
HDR photo
Macro mode
Recordable Image Formats
JPG
Recordable Video Formats
3G2 , MPEG4
Number of effective pixels
5.0 MP camera
Geographical Attributes
Mobile Operator
SoftBank Corp.
Market Countries
Japan
Secondary Camera System
Secondary Camera Sensor
CMOS
Secondary Video Recording
640x480 pixel
30 fps
Secondary Camera Placement
Front
Secondary Camera Resolution
1600x1200 pixel
Secondary Camera Number of pixels
1.9 MP sec. cam
Secondary Recordable Image Formats
JPG
Secondary Recordable Video Formats
3G2 , MPEG4
Communication Interfaces
IR
Yes
Yes
USB
USB 2.0
USB Hi-Speed (480 Mbps)
Bluetooth
Bluetooth 4.0
Internal antenna
USB Services
USB charging
USB Host
USB Power Delivery
Wireless LAN
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Internal antenna
USB Connector
USB Series Micro-B (Micro-USB)
Wireless Services
Wi-Fi Tethering
Bluetooth profiles
A2DP
AVRCP
Expansion Interfaces
TransFlash
microSD
microSDHC
Secondary Cellular Phone
Sec. Supported Cellular Networks
No
Secondary Auxiliary Camera
Sec. Aux. Cam. Image Sensor
No
Application processor, Chipset
CPU
Qualcomm Snapdragon 410 MSM8916, 2014, 64 bit, quad-core, 28 nm, Qualcomm Adreno 306 GPU
CPU Clock
1200 MHz
Secondary Auxiliary Camera No. 2
Sec. Aux. 2 Cam. Image Sensor
No
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