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Tungsten E

Tungsten E

from Palm
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Overview & Features

Brand
Palm
Model
Tungsten E
Released
2003 Oct
Manufacturer
Palm
General Extras
Passive stylus
Hardware Designer
Palm
List of Additional Features
docking station

Technical Specifications

Display

Pixel Size
0.17678 mm/pixel
Resolution
320x320
102400 pixels
Display Area
3200 square millimeter
Display Type
Color TN-TFT LCD
display
Display Width
56.57 mm
Pixel Density
144 PPI
Display Height
56.57 mm
Display Diagonal
80 mm
Display Color Depth
16 bit/pixel
Display Illumination
Yes
Display Subpixel Scheme
RGB Matrix (3 subpixels)
Display Area Utilization
36.0%
Number of Display Scales
65536
Scratch Resistant Screen
No
Horizontal Full Bezel Width
21.43 mm
Display Light Reflection Mode
transflective

Power Supply

Battery
Lithium-ion polymer (LiPo)
built-in
1-cell

Sound Playing

Audio Output
3.5mm
Loudspeaker(s)
mono

Cellular Phone

Supported Cellular Bands
No

Audio Subsystem

Audio Channel(s)
stereo

Sound Recording

Microphone(s)
No

Auxiliary Camera

Aux. Camera Image Sensor
No

Built-in Sensors

Built-in accelerometer
No

Operative Memory

RAM Type
SDRAM
RAM Capacity
32 MiB RAM
28.3 MiB user accessible RAM

Ingress Protection

Protection from liquids
Yes
Protection from solid materials
Yes

Control Peripherals

Directional Pad
Four-way (with action button)
-way
Touchscreen Type
Resistive touch sensing
screen
Touchscreen Simultaneous Touch Points
Single-touch

Graphical Subsystem

Graphical Controller
N/A

Non-volatile Memory

Non-volatile Memory Type
Flash EEPROM
Non-volatile Memory Capacity
8 MiB
Non-volatile Memory Interface
Yes

Physical Attributes

Mass
131 g
Depth
12 mm
Width
78 mm
Height
114 mm
Bounding Volume
106.7 ccm

Multimedia Broadcast

FM Radio Receiver
No

Satellite Navigation

Supported GPS protocol(s)
No

Software Environment

Platform
Palm OS
Operating System
PalmSource Palm OS 5.2
(5.2.1)

Audio/Video Interfaces

A/V Out
No

Auxiliary Camera No. 2

Aux. 2 Camera Image Sensor
No

Auxiliary Camera No. 3

Aux. 3 Camera Image Sensor
No

Auxiliary Camera No. 4

Aux. 4 Camera Focus
No
Aux. 4 Camera Image Sensor
No

Primary Camera System

Flash
No
Focus
No
Camera Image Sensor
No

Geographical Attributes

Market Countries
USA

Secondary Camera System

Secondary Camera Sensor
No

Communication Interfaces

IR
IrDA 1.2
115200bit/s (SIR/CIR)
USB
USB 1.1
USB Full-Speed (12 Mbps)
Bluetooth
No
Wireless LAN
No
USB Connector
USB Series Mini-B (mini-USB)
Expansion Interfaces
MMC
SD
Secure Digital Input/Output interface

Secondary Cellular Phone

Sec. Supported Cellular Networks
No

Secondary Auxiliary Camera

Sec. Aux. Cam. Image Sensor
No

Application processor, Chipset

CPU
Texas Instruments OMAP 311, 2002, 32 bit, single-core, 16 Kbyte I-Cache, 8 Kbyte D-Cache
CPU Clock
126 MHz

Secondary Auxiliary Camera No. 2

Sec. Aux. 2 Cam. Image Sensor
No

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